Coating solution

CN1 is a prompt provider of the metal and dielectric film coating solution services of semiconductor using the ALD/CVD technologies at an economical price.

  • Metal : Co, Ru, Ti, Ta, etc.
  • Metal oxide : Al2O3, TiO2, ZnO etc.
  • Nitride : TiN, TaN etc.
  • Thickness uniformity : < 3%
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*Rs uniformity(< 2%) of PEALD-Co coated by Atomic-Premium(8inch)

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*Available wafer size ; 2~8inch with custom’s needs
(blanket and pattern wafers)

Co on SiO2_1

*ALD-Co film coated by Atomic-Premium

Ru on Ta-SiO2_1

*ALD-Ru film coated by Atomic-Premium

TaN on SiO2_1

*ALD-TaN film coated by Atomic-Classic

TiN on SiO2

*ALD-TiN film coated by Atomic-Classic

HfO2_1

*ALD-HfO2 film coated by Atomic-Classic

Al2O3 on Si

*ALD-Al2O3 film coated by Atomic-Classic